?2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN4010 " Rev. 1.0.6
8
Physical Dimensions
Figure 15. 6-Lead MicroPak" Molded Leadless Package (MLP)
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without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
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specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductors online packaging area for the most recent package drawings:
http://fsce132/dwg/MA/MAC06A.pdf
.
2. D IM EN S IO N S AR E IN M ILLIM ETE R S
1. C O N FO R M S TO JED EC STAN D AR D M 0-252 VA R IA TIO N U AA D
4. FILEN AM E AN D R EVIS IO N : M AC 06A R EV 4
N otes:
3. D R AW IN G C O N FO R M S TO A SM E Y14.5M -1994
TO P VIEW
R EC O M M EN ED
LAN D PATTER N
BO TTO M VIEW
1.45
1.00
A
B
0.05 C
0.05 C
2X
2X
0.55M AX
0.05 C
(0.49)
(1)
(0.75)
(0.52)
(0.30)
6X
1X
6X
PIN 1
D ETAIL A
0.075 X 45
C H AM FER
0.25
0.15
0.35
0.25
0.40
0.30
0.5
(0.05)
1.0
5X
D ETAIL A
PIN 1 TER M IN AL
0.40
0.30
0.45
0.35
0.10
0.00
0.10
C B A
0.05
C
C
0.05 C
0.05
0.00
5X
5X
6X
(0.13)
4X
6X
PIN 1 ID EN TIFIER
(0.254)
5. PIN O N E ID EN TIFIER IS 2X LE N G TH O F AN Y
5
O TH ER LIN E IN TH E M A R K C O D E LA YO U T.